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Inline Automation

  • Micro Ball Attach and Reflow Automation

    Specifications:

    1. Reduce material waiting/idle time and improve efficiency.
    2. Reduce handling of material, and improve handling risks and quality.
    3. Processes of different clean room environment can be connected, improve process yield.
    4. MES ready with PC communication, and CCTV monitoring.

  • Inner Layer Inline Automation

    Specifications:

    1. Reduce material waiting/idle time and improve efficiency.
    2. Reduce handling of material, and improve handling risks and quality.
    3. Processes of different clean room environment can be connected, improve process yield.
    4. MES ready with PC communication, and CCTV monitoring.

  • Outer Layer Inline Automation

    Specifications:

    1. Reduce material waiting/idle time and improve efficiency.
    2. Reduce handling of material, and improve handling risks and quality.
    3. Processes of different clean room environment can be connected, improve process yield.
    4. MES ready with PC communication, and CCTV monitoring.

  • Solder Mask Inline Automation

    Specifications:

    1. Reduce material waiting/idle time and improve efficiency.
    2. Reduce handling of material, and improve handling risks and quality.
    3. Processes of different clean room environment can be connected, improve process yield.
    4. MES ready with PC communication, and CCTV monitoring.

  • Pretreatment, Lamination, LDI Inline Automation

    Specifications:

    1. Reduce material waiting/idle time and improve efficiency.
    2. Reduce handling of material, and improve handling risks and quality.
    3. Processes of different clean room environment can be connected, improve process yield.
    4. MES ready with PC communication, and CCTV monitoring.